Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
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ASE Technology Holding Co., Ltd. is a semiconductors company headquartered in Kaohsiung, Taiwan. It is publicly listed (ASX) with a market capitalisation of $89.7B. Xcout tracks 23 named people at ASE Technology Holding Co., Ltd., including Tien Wu (Group Chief Operating Officer & Representative Director).
17 more named people on record for ASE Technology Holding Co., Ltd., with roles, board committees and tenure — see the full roster →
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Orient Semiconductor Electronics, Ltd., founded in 1971 and based in Kaohsiung, Taiwan, operates globally as a manufacturer, assembler, processor, and vendor of diverse electronic components. Its product portfolio includes integrated circuits, semiconductor devices, computer motherboards, and a variety of electronic, computer, and communication circuit boards, serving markets in Taiwan, the United States, China, and other international locations. The company's activities are structured into two main divisions: the Semiconductor Business segment and the Electronic Manufacturing Services (EMS) segment. In its Semiconductor operations, Orient Semiconductor provides extensive integrated circuit (IC) packaging and testing solutions. This covers packaging services for both memory and logic ICs, along with various testing procedures such as wafer probing, automotive-grade assessments, flash memory verification, system-level testing, and functional evaluations of integrated circuits. These capabilities are crucial for a wide range of applications, including computing, communication, networking, consumer electronics, telecommunications, industrial control systems, automotive electronics, digital cameras, and other commercial products. The Electronic Manufacturing Services division encompasses both product manufacturing and related services. It produces a broad spectrum of items, such as computer motherboards and PC cards, solar controllers and inverters, photoelectric and industrial analytical measurement instruments, network communication security systems, automotive electronics, Internet of Things (IoT) devices, FPGA boards, USB drives, and solid-state drives. These specialized offerings cater to high-demand industries including oil and gas, aerospace and satellite, military and extreme environments, and medical sectors. Beyond manufacturing, the EMS segment delivers comprehensive services. These include printed circuit board (PCB) assembly, full box-build solutions, system integration, packaging, and thorough inspection and testing. Engineering support is extensive, covering new product introduction (NPI) management, design for manufacturability (DFM), design for testability (DFT), and managing engineering changes. Additionally, the company offers robust materials management solutions, encompassing material planning, supply chain oversight, and warehouse management systems. For clients seeking end-to-end support, Orient Semiconductor provides complete turnkey solutions, integrating services from wafer probing and substrate/lead frame design to manufacturing design, assembly, and testing.
Walton Advanced Engineering, Inc., founded in Kaohsiung, Taiwan, in 1995, specializes in providing memory assembly and testing solutions to both domestic and international clients. The company offers a comprehensive suite of turnkey services, including IC packaging, final product testing, burn-in procedures, and direct drop shipment to end customers. Furthermore, it delivers electrical testing and crucial back-end support. In addition to its service activities, the firm is actively engaged in the design, production, sale, and trade of integrated circuit equipment. Previously, the company operated under the name Walsin Advanced Engineering, Inc.
ChipMOS TECHNOLOGIES Inc. specializes in the research, development, manufacturing, and global sale of sophisticated integrated circuits, complemented by extensive assembly and testing services. The company's operations are divided into several key segments: Testing, Assembly, Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors, Bumping, and Other services. Its comprehensive back-end offerings include engineering tests, wafer probing, and final testing for both memory and logic/mixed-signal semiconductors, alongside package assembly using leadframe-based and organic substrate-based technologies. Furthermore, ChipMOS provides specialized services such as gold bumping, reel-to-reel assembly, and testing specifically for LCD and other display panel driver semiconductors. These semiconductors are integral to a wide array of applications, including personal computers, graphics systems like game consoles, communications infrastructure, mobile products such as cellular handsets and tablets, various consumer electronics, automotive and industrial systems, and display technologies. Established in 1997, ChipMOS TECHNOLOGIES Inc. is headquartered in Hsinchu, Taiwan, and serves clients across Taiwan, the People's Republic of China, Japan, Singapore, and other international markets.
Tong Hsing Electronic Industries, Ltd. engages in the development and production of thick film substrates and customized semiconductor micro-module packaging. It offers ceramic metalized substrate, such as direct plated copper, direct bonded copper, active metal brazing, and thick film printed circuit substrates; CMOS imaging products, including wafer probing and testing, wafer reconstruction, and packaging, and image testing. The company also provides high frequency wireless communication modules and power semiconductors module packaging products; and customized module packaging and testing comprising hybrid integrated circuit modules and biomedical products. Its products are used in automotive, handset, aerospace and network, medical, and others. The company was incorporated in 1974 and is based in New Taipei City, Taiwan.
Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products in Taiwan, Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. It provides chip probing and final test; IC packaging services, such as wafer level packing, flip chips, wire bond BGA, lead frame, and system in package; module assembly services; and quality management services. The company is also involved in the design, manufacturing, assembly, testing, and sale of semiconductors; metal surface treatment on semiconductor wire frame; and metal plating on semiconductor lead frame, as well as in investment and wafer probing testing activities. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
ASMPT supplies hardware and software solutions for the manufacturing of semiconductors and electronics. The company serves manufacturers in the semiconductor and electronics industries by providing advanced packaging, SMT placement, bonding, and material management technologies.
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