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BondLink Inc.

FintechUnited States

BondLink, Inc. is headquartered in Boston, Massachusetts, and provides financial technology solutions for the municipal bond market. The company empowers issuers to streamline their financing programs and improve transparency for investors.

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BondLink Inc. at a glance

BondLink Inc. is a fintech company headquartered in United States. Its most recent funding round, Series B, raised $18M in May 2021. Xcout tracks 2 named people at BondLink Inc., including Colin MacNaught (Co-Founder & CEO).

Industry
Fintech
Headquarters
United States

BondLink Inc. leadership

  • Colin MacNaughtCo-Founder & CEO
  • Carl QueryCo-Founder

BondLink Inc. funding rounds

Every round on record:

DateRoundAmountInvestors
Series B$18M—
SEC Form D filing$4M—
Series A$6M—
Series A$12.1M3 named
SEC Form D filing$775,000—

Who invested in each round, lead investors, valuations and the co-investor graph — open the full funding history →

Investors

BondLink Inc. competitors

A few of BondLink Inc.'s closest competitors — see the full list of competitors and alternatives →

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More on BondLink Inc. in Xcout Intel

  • 2 named people with titles, LinkedIn and board committees
  • 5 funding rounds with the investors in each, and who they co-invest with
  • The full competitor set, tracking, exports and API access
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