Taiwan Semiconductor Manufacturing Company Limited (TSMC), along with its affiliated entities, operates globally in the semiconductor industry, specializing in the manufacturing, packaging, meticulous testing, and worldwide distribution of integrated circuits and other crucial semiconductor components. Its expansive international presence covers key markets such as Taiwan, China, Europe, the Middle East, Africa, Japan, and the United States. The company is renowned for its diverse array of wafer fabrication processes. These capabilities enable the production of various advanced semiconductor types, including complementary metal-oxide-semiconductor (CMOS) logic, mixed-signal devices, radio frequency components, embedded memory, and bipolar CMOS mixed-signal circuits. Beyond its core foundry services, TSMC extends its offerings to include dedicated customer and engineering support. It also undertakes the production of specialized masks, actively invests in burgeoning technology startups, and manages the entire lifecycle—from research and development through to manufacturing, packaging, testing, and sales—of color filters. Furthermore, the company provides a range of investment services. TSMC's cutting-edge products are indispensable across numerous sectors, powering high-performance computing, modern smartphones, Internet of Things (IoT) ecosystems, sophisticated automotive systems, and a broad spectrum of digital consumer electronics. Established in 1987, the enterprise is officially headquartered in Hsinchu City, Taiwan.
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Taiwan Semiconductor Manufacturing Company Ltd. is a semiconductors company headquartered in Hsinchu City, Taiwan, founded in 1987. It is publicly listed (TSM) with a market capitalisation of $2.2T. Xcout tracks 21 named people at Taiwan Semiconductor Manufacturing Company Ltd., including C. C. Wei (Chairman & Chief Executive Officer).
15 more named people on record for Taiwan Semiconductor Manufacturing Company Ltd., with roles, board committees and tenure — see the full roster →
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United Microelectronics Corporation (UMC) operates as a specialized semiconductor wafer foundry, extending its services globally with operations across Taiwan, Singapore, China, Hong Kong, Japan, the United States, and Europe. The company offers a comprehensive range of solutions, from initial circuit blueprinting and mask generation to wafer manufacturing, final assembly, and rigorous testing. UMC's customer base consists of both integrated device manufacturers and companies focused solely on chip design. This corporation, founded in 1980, has its primary headquarters situated in Hsinchu City, Taiwan.
VisEra Technologies Company Ltd., headquartered in Hsinchu City, Taiwan, is a global producer and supplier of electronic components. Established in 2003, the company operates as a key subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC). VisEra is deeply involved in the entire lifecycle of color filters, encompassing everything from initial design, research, and development, through manufacturing, packaging, and rigorous testing, all the way to market distribution. Beyond color filters, their product portfolio extends to a variety of sophisticated sensors, including image sensors, optical fingerprint sensors, ambient light sensors, and time-of-flight sensors. The company also offers specialized services such as wafer-level testing and the application of optical thin films at the wafer level. Furthermore, VisEra provides comprehensive optical component services, covering manufacturing, simulation, integration, wafer-level characterization, and tailored solutions to meet specific client needs. These advanced products and services are integral to a wide range of modern applications, including the automotive industry, security systems, augmented and virtual reality devices, smart home technology, mobile communication devices, and biomedical sensing equipment. VisEra distributes its offerings across Taiwan, various other parts of Asia, Europe, and the United States.
ChipMOS TECHNOLOGIES Inc. specializes in the research, development, manufacturing, and global sale of sophisticated integrated circuits, complemented by extensive assembly and testing services. The company's operations are divided into several key segments: Testing, Assembly, Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors, Bumping, and Other services. Its comprehensive back-end offerings include engineering tests, wafer probing, and final testing for both memory and logic/mixed-signal semiconductors, alongside package assembly using leadframe-based and organic substrate-based technologies. Furthermore, ChipMOS provides specialized services such as gold bumping, reel-to-reel assembly, and testing specifically for LCD and other display panel driver semiconductors. These semiconductors are integral to a wide array of applications, including personal computers, graphics systems like game consoles, communications infrastructure, mobile products such as cellular handsets and tablets, various consumer electronics, automotive and industrial systems, and display technologies. Established in 1997, ChipMOS TECHNOLOGIES Inc. is headquartered in Hsinchu, Taiwan, and serves clients across Taiwan, the People's Republic of China, Japan, Singapore, and other international markets.
Semiconductor Manufacturing International Corporation operates as an investment holding entity, primarily focusing on the computer-aided design, fabrication, testing, packaging, and commercial distribution of integrated circuits (ICs). Its market reach spans North America, China, broader Asia, Hong Kong, and Eurasia. Beyond its core IC business, the company is involved in the technical research, development, manufacturing, and sale of semiconductor masks, alongside offering specialized semiconductor foundry and technology services. Its diverse activities also include the construction, management, and operation of residential living quarters. Furthermore, SMIC provides comprehensive support services encompassing design, intellectual property assistance, and photomask manufacturing, in addition to marketing-related services and private educational provisions. The corporation was established in 2000 and maintains its headquarters in Shanghai, People's Republic of China.
Realtek Semiconductor Corp., along with its affiliated entities, is dedicated to the design, development, manufacturing, and global distribution of integrated circuits (ICs) and their accompanying software. Its business reach extends across Taiwan and international markets. The company's diverse product portfolio features a comprehensive array of communication network ICs. These encompass broadband access, gateway, network interface, and high-speed bridge controllers, alongside digital home hub components, PHYceivers, switch controllers, and chips for wireless LANs and DTV demodulation. Realtek also delivers solutions for Bluetooth, GNSS (Global Navigation Satellite System), and Internet of Things applications. Furthermore, Realtek supplies integrated circuits tailored for computer peripherals. This category includes audio codecs for both personal computers and general consumer use, card reader solutions, Class-D audio amplifiers, PC camera controllers, Type-C Power Delivery (PD) controllers, and USB hubs. Multimedia ICs represent another significant offering from the company. Beyond its core chip operations, Realtek is involved in the production and installation of computer hardware. The firm conducts both wholesale and retail trade of electronic materials and software, providing related support services. Additionally, it furnishes consulting, information, and technical assistance. Founded in 1987, Realtek Semiconductor Corp. is headquartered in Hsinchu City, Taiwan.
ASE Technology Holding Co., Ltd., established in 1984 and headquartered in Kaohsiung, Taiwan, operates as a prominent global provider of semiconductor packaging, testing, and electronic manufacturing services. The company serves clients across the United States, Taiwan, the wider Asian region, Europe, and other international markets. Its extensive service portfolio includes a broad array of packaging solutions, from conventional options like various BGA, CSP, QFP, and QFN packages, to advanced techniques such as flip chip BGA, fan-out wafer-level packaging, and 2.5D silicon interposer technology. ASE also specializes in stacked die solutions, copper and silver wire bonding, the development of system-in-package (SiP) products and modules, and the provision of interconnect materials, including the assembly of automotive electronic components. Its comprehensive testing capabilities span front-end engineering, wafer probing, and final testing for diverse devices including logic, mixed-signal, RF modules, SiP, MEMS, and discrete components. Beyond its core semiconductor operations, the company is involved in a variety of other ventures, such as real estate development and management, substrate production, information software, equipment leasing, investment advisory, warehousing management, and the processing and trade of computer, communication peripherals, and electronic components.
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