Xcout Intel
ASEH competitors & alternatives
The 12 closest competitors and alternatives to ASEH among semiconductors companies — ranked by similarity to what ASEH actually does, not by market-cap band.
Subscribe to see ASEH’s full profile → the full roster, investors in every round, weekly hiring history and every corporate event
About ASEH
ASE Technology Holding Co., Ltd., established in 1984 and headquartered in Kaohsiung, Taiwan, operates as a prominent global provider of semiconductor packaging, testing, and electronic manufacturing services. The company serves clients across the United States, Taiwan, the wider Asian region, Europe, and other international markets. Its extensive service portfolio includes a broad array of packaging solutions, from conventional options like various BGA, CSP, QFP, and QFN packages, to advanced techniques such as flip chip BGA, fan-out wafer-level packaging, and 2.5D silicon interposer technology. ASE also specializes in stacked die solutions, copper and silver wire bonding, the development of system-in-package (SiP) products and modules, and the provision of interconnect materials, including the assembly of automotive electronic components. Its comprehensive testing capabilities span front-end engineering, wafer probing, and final testing for diverse devices including logic, mixed-signal, RF modules, SiP, MEMS, and discrete components. Beyond its core semiconductor operations, the company is involved in a variety of other ventures, such as real estate development and management, substrate production, information software, equipment leasing, investment advisory, warehousing management, and the processing and trade of computer, communication peripherals, and electronic components.
ASEH at a glance
ASEH is a semiconductors company headquartered in Taiwan. It is publicly listed (3711) with a market capitalisation of $91.7B. Xcout tracks 9 named people at ASEH, including Tien Wu (Director Chief Operating Officer).
ASEH leadership
- Tien WuDirector Chief Operating Officer
- Andrew TangDirector Chief Procurement Officer
- Richard H.P. ChangDirector & Vice Chairman President
- Dan-Yao ChangDirector Special Assistant to Chairman
- Jason C.S. ChangDirector & Chairman
- Jeffrey ChenDirector Chairman of Universal Scientific Industrial (Shanghai) Co., Ltd.
3 more named people on record for ASEH, with roles, board committees and tenure — see the full roster →
Top 12 ASEH competitors
Ranked by semantic similarity — how close each company is to ASEH by what it does, using Xcout's live company graph. Click any company for its full profile, or its competitor set.
Similar semiconductors company
Orient Semiconductor Electronics, Ltd., founded in 1971 and based in Kaohsiung, Taiwan, operates globally as a manufacturer, assembler, processor, and vendor of diverse electronic components. Its product portfolio includes integrated circuits, semiconductor devices, computer motherboards, and a variety of electronic, computer, and communication circuit boards, serving markets in Taiwan, the United States, China, and other international locations. The company's activities are structured into two main divisions: the Semiconductor Business segment and the Electronic Manufacturing Services (EMS) segment. In its Semiconductor operations, Orient Semiconductor provides extensive integrated circuit (IC) packaging and testing solutions. This covers packaging services for both memory and logic ICs, along with various testing procedures such as wafer probing, automotive-grade assessments, flash memory verification, system-level testing, and functional evaluations of integrated circuits. These capabilities are crucial for a wide range of applications, including computing, communication, networking, consumer electronics, telecommunications, industrial control systems, automotive electronics, digital cameras, and other commercial products. The Electronic Manufacturing Services division encompasses both product manufacturing and related services. It produces a broad spectrum of items, such as computer motherboards and PC cards, solar controllers and inverters, photoelectric and industrial analytical measurement instruments, network communication security systems, automotive electronics, Internet of Things (IoT) devices, FPGA boards, USB drives, and solid-state drives. These specialized offerings cater to high-demand industries including oil and gas, aerospace and satellite, military and extreme environments, and medical sectors. Beyond manufacturing, the EMS segment delivers comprehensive services. These include printed circuit board (PCB) assembly, full box-build solutions, system integration, packaging, and thorough inspection and testing. Engineering support is extensive, covering new product introduction (NPI) management, design for manufacturability (DFM), design for testability (DFT), and managing engineering changes. Additionally, the company offers robust materials management solutions, encompassing material planning, supply chain oversight, and warehouse management systems. For clients seeking end-to-end support, Orient Semiconductor provides complete turnkey solutions, integrating services from wafer probing and substrate/lead frame design to manufacturing design, assembly, and testing.
Similar semiconductors company
ChipMOS TECHNOLOGIES Inc. specializes in the research, development, manufacturing, and global sale of sophisticated integrated circuits, complemented by extensive assembly and testing services. The company's operations are divided into several key segments: Testing, Assembly, Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors, Bumping, and Other services. Its comprehensive back-end offerings include engineering tests, wafer probing, and final testing for both memory and logic/mixed-signal semiconductors, alongside package assembly using leadframe-based and organic substrate-based technologies. Furthermore, ChipMOS provides specialized services such as gold bumping, reel-to-reel assembly, and testing specifically for LCD and other display panel driver semiconductors. These semiconductors are integral to a wide array of applications, including personal computers, graphics systems like game consoles, communications infrastructure, mobile products such as cellular handsets and tablets, various consumer electronics, automotive and industrial systems, and display technologies. Established in 1997, ChipMOS TECHNOLOGIES Inc. is headquartered in Hsinchu, Taiwan, and serves clients across Taiwan, the People's Republic of China, Japan, Singapore, and other international markets.
Similar semiconductors company
Walton Advanced Engineering, Inc., founded in Kaohsiung, Taiwan, in 1995, specializes in providing memory assembly and testing solutions to both domestic and international clients. The company offers a comprehensive suite of turnkey services, including IC packaging, final product testing, burn-in procedures, and direct drop shipment to end customers. Furthermore, it delivers electrical testing and crucial back-end support. In addition to its service activities, the firm is actively engaged in the design, production, sale, and trade of integrated circuit equipment. Previously, the company operated under the name Walsin Advanced Engineering, Inc.
Semiconductor Equipment
ASMPT supplies hardware and software solutions for the manufacturing of semiconductors and electronics. The company serves manufacturers in the semiconductor and electronics industries by providing advanced packaging, SMT placement, bonding, and material management technologies.
Similar semiconductors company
Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products in Taiwan, Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. It provides chip probing and final test; IC packaging services, such as wafer level packing, flip chips, wire bond BGA, lead frame, and system in package; module assembly services; and quality management services. The company is also involved in the design, manufacturing, assembly, testing, and sale of semiconductors; metal surface treatment on semiconductor wire frame; and metal plating on semiconductor lead frame, as well as in investment and wafer probing testing activities. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
Similar semiconductors company
China Wafer Level CSP Co., Ltd. is a semiconductor company that provides wafer-level chip size packaging and testing services. The company specializes in 3DIC, TSV, interconnect, and imaging technologies for applications such as sensors, CMOS imaging sensors, RFID, MEMS devices, and LEDs.
Similar semiconductors company
Tong Hsing Electronic Industries, Ltd. engages in the development and production of thick film substrates and customized semiconductor micro-module packaging. It offers ceramic metalized substrate, such as direct plated copper, direct bonded copper, active metal brazing, and thick film printed circuit substrates; CMOS imaging products, including wafer probing and testing, wafer reconstruction, and packaging, and image testing. The company also provides high frequency wireless communication modules and power semiconductors module packaging products; and customized module packaging and testing comprising hybrid integrated circuit modules and biomedical products. Its products are used in automotive, handset, aerospace and network, medical, and others. The company was incorporated in 1974 and is based in New Taipei City, Taiwan.
Similar semiconductors company
China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, lead frame, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services, as well as packaging and testing services. In addition, the company offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives, as well as FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. Further, it engages in research and development; patent management; field application promotion; investment management; and technology development activities. It exports its products. The company serves mobile handset manufacturers and semiconductor chip design houses. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.
Similar semiconductors company
Chang Wah Electromaterials Inc. is a Taiwanese enterprise that primarily functions as an agent for integrated circuit (IC) packaging materials and specialized equipment. Its extensive product range includes various IC packaging materials, along with IC packaging machinery such as automated molding, trim and form, and package sawing equipment, as well as fluid dispensing systems. The company also provides Thin-Film Transistor Liquid-Crystal Display (TFT-LCD) products and is active in LED technology, offering liquid compound/compression mold technology and LED lead frames for both ejection and transfer molding (EMC LED lead frames). Additionally, it supplies solar power systems. Beyond these offerings, Chang Wah Electromaterials engages in the trade of electrical, telecommunication, and semiconductor materials and parts, alongside the retail of synthetic resins and electronic components. Its comprehensive operations further extend to the import, export, trading, leasing, manufacturing, and sale of electrical appliances, telecommunications gear, and mechanical parts. The company was founded in Kaohsiung, Taiwan, in 1989.
Similar semiconductors company
JCET Group Co., Ltd., originally founded in Jiangyin, China, in 1972, operates as a global provider of integrated-circuit fabrication and associated technology services. The company specializes in a variety of semiconductor packaging methodologies, including advanced wafer-level packaging, system-in-package (SiP) solutions, flip chip technology, and wire bonding. These offerings cater to a broad spectrum of demanding applications, such as mobile communications, telecommunications infrastructure, computing platforms, consumer electronics, automotive systems, and industrial sectors. Beyond manufacturing, JCET also delivers comprehensive support services, covering design and characterization, research and development (R&D), wafer probing, bumping processes, package assembly, logistics, and rigorous product testing. The firm, which was previously named Jiangsu Changjiang Electronics Technology Co., Ltd., officially rebranded to JCET Group Co., Ltd. in November 2019.
Similar semiconductors company
King Yuan Electronics Co., Ltd. designs, manufactures, sells, tests, and assembles integrated circuits. It offers test services, such as wafer probing; final test; burn-in; system level testing; and back end service. It also provides Technology Innovation, including wafer level chip scale package (WLCSP); high power burn in; and KYEC Bio Chip Testing, as well as equipment development, spare parts and test program, automation control, and vertical card. It also provides engineering services for Memory applications; consumer electronics testing solutions for games, digital audio, digital TV, set top box, and others; logic and mixed signal IC testing services; liquid crystal display driver test solutions for TFT LCD, Gate Drivers, STN segment/common drivers, LCD controllers/drivers and OLED controllers/drivers; and pupil module solution, CSP FT test solution, high parallelism test solution for area image sensor, low temperature test solution, and light sensor test solutions. In addition, the company offers radio system integration, feasibility studies for cost and performance, circuit design and characterization, evaluation board design service, process definition services; testing, diagnosis, verification, characterization, and debugging services for SOC devices, such as ASIC and ASSP; micro-electro mechanical systems and biochip testing solutions; and technology support services. The company was incorporated in 1987 and is headquartered in Hsinchu City, Taiwan.
Similar semiconductors company
ShunSin Technology Holdings Limited engages in the assembly, testing, and sale of various integrated circuits related to semiconductors in Mainland China, the United States, Taiwan, Malaysia, Singapore, Ireland, and internationally. The company’s products include system in package module, including 2G/2.5G/3G/4G front end and power Amplifier (PA), multi-mode multi band power amplifier, WiFi front end, mobile WiFi, and antenna switch modules; passive optical components; optical transceivers; thick film integrated circuit; and MEMS modules and sensors, such as accelerometers, gyroscopes, G-sensors, pressure and gesture sensors, light and proximity sensors, BAW filters, and TOF sensors. It offers engineering services, such as assembly and testing. The company was formerly known as Amtec Holdings Limited and changed its name to ShunSin Technology Holdings Limited in August 2013. The company was incorporated in 2008 and is based in Zhongshan, China. ShunSin Technology Holdings Limited is a subsidiary of Foxconn (Far East) Limited.
Analyze another company
Search any company we track to see its competitive set.
Or describe a company
Paste a short paragraph describing a company or product — we'll find the most similar companies we track, scored 1–100.
See the full profile of ASEH and its market
Funding, investors, tech stack, hiring signals, leadership and corporate events — for ASEHand every competitor above — in one live dashboard.
Subscribe to Xcout Intel →