Everspin Technologies, Inc. is a global provider specializing in the development and distribution of advanced magnetoresistive random access memory (MRAM) products. The company's market reach extends across various international regions, including key territories like the United States, Hong Kong, Japan, China, and Canada. Its comprehensive product line encompasses Toggle MRAM, spin-transfer torque MRAM (STT-MRAM), and tunnel magneto resistance (TMR) sensor components, alongside offering foundry services for embedded MRAM solutions. These high-performance memory devices are deployed in a wide array of demanding applications, serving sectors such as data centers, industrial automation, medical technology, automotive and transportation systems, and the aerospace industry. Everspin supplies its offerings to both original equipment manufacturers (OEMs) and original design manufacturers (ODMs) through a combination of direct sales efforts and a robust network of representatives and distributors. The company, which was founded in 2008, is headquartered in Chandler, Arizona.
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Everspin Technologies, Inc. is a semiconductors company headquartered in Chandler, United States. It is publicly listed (MRAM) with a market capitalisation of $419.6M. Xcout tracks 20 named people at Everspin Technologies, Inc., including Sanjeev Aggarwal (President, Chief Executive Officer & Director).
14 more named people on record for Everspin Technologies, Inc., with roles, board committees and tenure — see the full roster →
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GSI Technology, Inc. (GSIT) operates as a fabless semiconductor company, specializing in the creation, development, and commercialization of sophisticated memory solutions. These products cater to a global clientele across vital industries such as networking, industrial, medical, aerospace, and defense, with a market presence spanning the United States, China, Singapore, Germany, the Netherlands, and other international territories. A core offering from GSI Technology includes its associative processing unit (APU) products. These innovative units are specifically designed to enable similarity search functionalities, supporting diverse applications like visual search queries in e-commerce, computer vision, pharmaceutical discovery, cybersecurity, and various service sectors. Furthermore, the company provides an extensive portfolio of static random access memory (SRAM) options. This range features SyncBurst SRAMs, suitable for microprocessor caches and other applications; No Bus Turnaround SRAMs, crafted to address specific needs in networking and telecommunications; and SigmaQuad and SigmaDDR products, which meet the high-density and rapid random transaction rate demands of networking and telecom systems. Additionally, GSIT offers Low Latency DRAMs, an optimal solution for advanced data networking, as well as Asynchronous SRAM, serving as primary memory for compact, cache-less embedded processors utilized in industrial electronics, measurement instruments, and cost-sensitive networking equipment. A selection of other specialized SRAMs rounds out their memory offerings. For demanding operational environments, GSI Technology also manufactures radiation-hardened and radiation-tolerant SRAMs, crucial for aerospace and military applications such as networking satellites and missile guidance systems. These semiconductor solutions are integrated as essential components within the final products of the company's Original Equipment Manufacturer (OEM) partners. Their applications are broad, encompassing networking and telecommunications devices (e.g., routers, switches), advanced military and aerospace systems (e.g., radar, guidance systems, satellites), audio/video processing, high-speed test and measurement equipment, automotive technology (e.g., smart cruise control), and medical imaging devices (e.g., ultrasound, CAT scan machines). The distribution of GSI Technology's products is managed through an extensive network of independent sales representatives and authorized distributors. Established in 1995, the company maintains its corporate headquarters in Sunnyvale, California.
Avalanche Technology Inc. is headquartered in Fremont, California, and is a leader in next-generation Spin Transfer Torque Magnetic RAM (STT-MRAM) technology.
Dosilicon Co., Ltd. operates as a global provider of memory chip solutions, specializing in the design, manufacturing, and distribution of these components through a fabless business model. Its product portfolio encompasses a range of memory types, including NAND flash, NOR flash, and dynamic random-access memory (DRAM) chips, alongside various multi-chip packaging options. These memory solutions find extensive utility across diverse industries such as industrial automation, mobile technology, telecommunications, the Internet of Things (IoT), and security systems. Established in 2014, the firm maintains its primary operational base in Shanghai, China.
Rambus Inc. is a global provider of semiconductor solutions, operating across key regions including the United States, Taiwan, South Korea, Japan, Europe, Canada, Singapore, and China. Their product portfolio encompasses advanced DDR memory interface chips, such as DDR5, DDR4, and DDR3, which are supplied to module manufacturers and original equipment manufacturers (OEMs). Additionally, Rambus delivers silicon intellectual property (IP), offering interface and security solutions vital for moving and safeguarding data in sophisticated applications. They also provide physical interface and digital controller IP, enabling the creation of industry-leading, integrated memory and interconnect subsystems. The company further holds an extensive patent portfolio, encompassing innovations in memory architecture, high-speed serial link technologies, and security products. Rambus distributes its offerings via a direct sales team and a network of distributors. Established in 1990, Rambus Inc. maintains its corporate headquarters in San Jose, California.
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
Micron Technology, Inc. is a global leader specializing in the development, manufacture, and sale of advanced semiconductor memory and storage solutions. Its operations are structured across four primary business segments: Compute and Networking, Mobile, Storage, and Embedded. The company's product portfolio encompasses a range of memory and data storage technologies. These include high-speed, low-latency Dynamic Random Access Memory (DRAM) components for rapid data retrieval; non-volatile, re-programmable NAND flash storage devices; and fast-read, non-volatile, re-writable NOR memory chips. These innovative solutions are offered under its well-known Micron and Crucial brands, as well as through private label partnerships. Micron's extensive offerings cater to a diverse array of markets and applications. This includes critical infrastructure like cloud servers and enterprise data centers, personal computing (client and graphics), mobile devices such as smartphones, networking equipment, automotive systems, industrial applications, and various consumer electronics. The company utilizes a multi-faceted approach to market its products, employing a direct sales force, independent sales representatives, and a network of distributors and retailers. Additionally, it leverages a web-based direct sales channel and collaborates with various channel and distribution partners. Founded in 1978, Micron Technology, Inc. is headquartered in Boise, Idaho.
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