Xcout IntelMicroview Intelligent Packaging Technology
Microview Intelligent Packaging Technology (Shenzhen) Co., Ltd, founded in 2019, is a specialized national-level enterprise headquartered in China. The company focuses on the research, development, and production of high-precision chip packaging equipment, including die bonders, flip chip bonders, and micro assembly bonders.
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Microview Intelligent Packaging Technology at a glance
Microview Intelligent Packaging Technology is a packaging technology company headquartered in China. Its most recent funding round, Series B, closed in August 2025.
Microview Intelligent Packaging Technology funding rounds
Every round on record:
| Date | Round | Amount | Investors |
|---|---|---|---|
| Series B | Undisclosed | 3 named | |
| — | Undisclosed | 4 named |
Who invested in each round, lead investors, valuations and the co-investor graph — open the full funding history →
Investors
Microview Intelligent Packaging Technology competitors
A few of Microview Intelligent Packaging Technology's closest competitors — see the full list of competitors and alternatives →
MBO America provides advanced finishing solutions, such as folding, die-cutting, roll-fed finishing, and automation systems, designed for the printing and packaging industries. The company also offers support services including equipment maintenance, training, and genuine OEM replacement parts.
Shenzhen MYIR Technology is a high-tech enterprise specializing in the design, research, development, production, and sales of embedded processor modules, industrial control boards, and development tools.
Nearfield Instruments develops automated high-throughput 3D scanning probe metrology systems, including atomic force microscopy solutions for atom-scale resolution. The company provides these advanced process control and metrology solutions to customers in the high-end nano-electronics and semiconductor industries.
Jiangsu Leadmicro Nano Technology Co., Ltd. is a Chinese manufacturer of semiconductor and photovoltaic thin-film deposition equipment, including atomic layer deposition (ALD) systems. It supplies process equipment to semiconductor and solar-cell manufacturers for applications such as advanced wafer and cell fabrication.
Anda Enterprise Group (Suzhou Anda Microelectronics Technology Co., Ltd.) is a high-tech enterprise specializing in the research, development, production, and sales of electronic chemicals, particularly photosensitive materials and substrate polishing liquids. Its primary products include photoresists, developers, stripping solutions, OC glue, BM glue, PGMEA, and IPA, which are used in integrated circuits, panel displays, optoelectronics, and compound semiconductors.
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More on Microview Intelligent Packaging Technology in Xcout Intel
- 2 funding rounds with the investors in each, and who they co-invest with
- The full competitor set, tracking, exports and API access