SkyWater Technology, Inc.

Silicon BoxSemiconductorsSingapore

65% match

Silicon Box is a Singapore-based semiconductor company that develops and manufactures advanced packaging solutions, including chiplet integration and heterogeneous semiconductor packaging. It serves fabless chip companies and other semiconductor customers seeking high-performance, customized packaging and integration services.

Ichor Holdings, Ltd. specializes in the creation, engineering, and production of fluid delivery subsystems and components tailored for semiconductor capital equipment. Their core products consist of gas and chemical delivery systems and subsystems, crucial for manufacturing semiconductor devices. Specifically, their gas delivery subsystems regulate, monitor, and distribute gases essential for semiconductor processes like etch and deposition. Meanwhile, their chemical delivery subsystems are designed to blend and dispense the reactive liquid chemistries integral to semiconductor manufacturing operations such as chemical-mechanical planarization, electroplating, and cleaning. The company also manufactures a range of precision components, including machined parts, various weldments (electron beam, laser-welded), precision vacuum and hydrogen brazing, surface treatment technologies, and other proprietary items, all intended for integration into fluid delivery systems. Ichor markets its offerings directly and through resellers to original equipment manufacturers (OEMs) within the semiconductor equipment market, serving customers across the United States, the United Kingdom, Singapore, Malaysia, Korea, Mexico, and other international regions. Founded in 1999, Ichor Holdings, Ltd. maintains its headquarters in Fremont, California.

Polar SemiconductorSemiconductorsUnited States

75% matchAI 22/100 ▲Green 0/100

Polar Semiconductor is a U.S. semiconductor manufacturer and foundry based in Bloomington, Minnesota. It produces power semiconductor devices and related components for customers in automotive, industrial, aerospace, and other electronics markets.

CROSSFIRE TECHNOLOGIES INCSemiconductorsUnited States

72% matchPrivate

CrossFire Technologies Inc. is a fabless semiconductor company headquartered in Minnesota. The company builds advanced chiplet interconnect solutions to support artificial intelligence and high-performance computing infrastructure.

GlobalFoundriesGFS · SemiconductorsMalta, United States

68% matchPublicAI 12/100

GLOBALFOUNDRIES Inc. operates as a prominent global semiconductor foundry, specializing in the creation of integrated circuits. These vital components are instrumental in powering a wide array of ubiquitous electronic devices. The company's diverse portfolio includes the manufacturing of various semiconductor devices, such as microprocessors, mobile application processors, baseband and network processors, radio frequency modems, microcontrollers, power management units, and microelectromechanical systems. Additionally, it offers comprehensive wafer fabrication services and advanced technological solutions. Established in 2009, the firm maintains its headquarters in Malta, New York.

Amkor TechnologyAMKR · SemiconductorsUnited States

67% matchPublic

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.