ams-OSRAM

ASMPT00522 · SemiconductorsSingapore, Singapore

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ASMPT, formerly known as ASM Pacific Technology, is a Singapore-headquartered company listed in Hong Kong that designs and manufactures machines and tools used in semiconductor and electronics assembly industries. It was originally the Asia division of ASM International (ASM).

OSE2329 · SemiconductorsTaiwan

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Orient Semiconductor Electronics, Ltd., founded in 1971 and based in Kaohsiung, Taiwan, operates globally as a manufacturer, assembler, processor, and vendor of diverse electronic components. Its product portfolio includes integrated circuits, semiconductor devices, computer motherboards, and a variety of electronic, computer, and communication circuit boards, serving markets in Taiwan, the United States, China, and other international locations. The company's activities are structured into two main divisions: the Semiconductor Business segment and the Electronic Manufacturing Services (EMS) segment. In its Semiconductor operations, Orient Semiconductor provides extensive integrated circuit (IC) packaging and testing solutions. This covers packaging services for both memory and logic ICs, along with various testing procedures such as wafer probing, automotive-grade assessments, flash memory verification, system-level testing, and functional evaluations of integrated circuits. These capabilities are crucial for a wide range of applications, including computing, communication, networking, consumer electronics, telecommunications, industrial control systems, automotive electronics, digital cameras, and other commercial products. The Electronic Manufacturing Services division encompasses both product manufacturing and related services. It produces a broad spectrum of items, such as computer motherboards and PC cards, solar controllers and inverters, photoelectric and industrial analytical measurement instruments, network communication security systems, automotive electronics, Internet of Things (IoT) devices, FPGA boards, USB drives, and solid-state drives. These specialized offerings cater to high-demand industries including oil and gas, aerospace and satellite, military and extreme environments, and medical sectors. Beyond manufacturing, the EMS segment delivers comprehensive services. These include printed circuit board (PCB) assembly, full box-build solutions, system integration, packaging, and thorough inspection and testing. Engineering support is extensive, covering new product introduction (NPI) management, design for manufacturability (DFM), design for testability (DFT), and managing engineering changes. Additionally, the company offers robust materials management solutions, encompassing material planning, supply chain oversight, and warehouse management systems. For clients seeking end-to-end support, Orient Semiconductor provides complete turnkey solutions, integrating services from wafer probing and substrate/lead frame design to manufacturing design, assembly, and testing.

Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

ASEH3711 · SemiconductorsTaiwan

63% matchPublic

ASE Technology Holding Co., Ltd., established in 1984 and headquartered in Kaohsiung, Taiwan, operates as a prominent global provider of semiconductor packaging, testing, and electronic manufacturing services. The company serves clients across the United States, Taiwan, the wider Asian region, Europe, and other international markets. Its extensive service portfolio includes a broad array of packaging solutions, from conventional options like various BGA, CSP, QFP, and QFN packages, to advanced techniques such as flip chip BGA, fan-out wafer-level packaging, and 2.5D silicon interposer technology. ASE also specializes in stacked die solutions, copper and silver wire bonding, the development of system-in-package (SiP) products and modules, and the provision of interconnect materials, including the assembly of automotive electronic components. Its comprehensive testing capabilities span front-end engineering, wafer probing, and final testing for diverse devices including logic, mixed-signal, RF modules, SiP, MEMS, and discrete components. Beyond its core semiconductor operations, the company is involved in a variety of other ventures, such as real estate development and management, substrate production, information software, equipment leasing, investment advisory, warehousing management, and the processing and trade of computer, communication peripherals, and electronic components.

Sanken Electric Co., Ltd. engages in the creation, acquisition, and distribution of electrical machinery and related devices. Its operations are organized into two principal divisions: Semiconductor Devices and Power Systems. The Semiconductor Devices division focuses on developing and commercializing a broad array of components, including power modules, various integrated circuits (power, control, and Hall-effect types), bipolar transistors, MOSFETs, IGBTs, thyristors, rectifier diodes, and light-emitting diodes. In parallel, the Power Systems division is responsible for producing and supplying products such as uninterruptible power supplies (UPS), inverters, DC power sources, airway beacon systems, switching mode power supply units, and transformers. These offerings find extensive application across numerous sectors, such as the automotive industry, household appliances ("white goods"), industrial equipment, office automation systems, and consumer electronics like televisions and audio systems. Additionally, the company undertakes construction projects, particularly those related to electronic and telecommunication infrastructure. Sanken Electric maintains a significant international footprint, conducting business in key markets including Japan, China, Korea, the United States, Europe, and beyond. The company was established in 1946. Initially known as Toho Sanken Electric Co., Ltd., it formally adopted the name Sanken Electric Co., Ltd. in June 1962. Its corporate headquarters are situated in Niiza, Japan.

ShunSin Technology Holdings Limited engages in the assembly, testing, and sale of various integrated circuits related to semiconductors in Mainland China, the United States, Taiwan, Malaysia, Singapore, Ireland, and internationally. The company’s products include system in package module, including 2G/2.5G/3G/4G front end and power Amplifier (PA), multi-mode multi band power amplifier, WiFi front end, mobile WiFi, and antenna switch modules; passive optical components; optical transceivers; thick film integrated circuit; and MEMS modules and sensors, such as accelerometers, gyroscopes, G-sensors, pressure and gesture sensors, light and proximity sensors, BAW filters, and TOF sensors. It offers engineering services, such as assembly and testing. The company was formerly known as Amtec Holdings Limited and changed its name to ShunSin Technology Holdings Limited in August 2013. The company was incorporated in 2008 and is based in Zhongshan, China. ShunSin Technology Holdings Limited is a subsidiary of Foxconn (Far East) Limited.