ams-OSRAM competitors & alternatives

ASMPT00522 · SemiconductorsSingapore, Singapore

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ASMPT, formerly known as ASM Pacific Technology, is a Singapore-headquartered company listed in Hong Kong that designs and manufactures machines and tools used in semiconductor and electronics assembly industries. It was originally the Asia division of ASM International (ASM).

OSE2329 · SemiconductorsTaiwan

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Orient Semiconductor Electronics, Ltd., founded in 1971 and based in Kaohsiung, Taiwan, operates globally as a manufacturer, assembler, processor, and vendor of diverse electronic components. Its product portfolio includes integrated circuits, semiconductor devices, computer motherboards, and a variety of electronic, computer, and communication circuit boards, serving markets in Taiwan, the United States, China, and other international locations. The company's activities are structured into two main divisions: the Semiconductor Business segment and the Electronic Manufacturing Services (EMS) segment. In its Semiconductor operations, Orient Semiconductor provides extensive integrated circuit (IC) packaging and testing solutions. This covers packaging services for both memory and logic ICs, along with various testing procedures such as wafer probing, automotive-grade assessments, flash memory verification, system-level testing, and functional evaluations of integrated circuits. These capabilities are crucial for a wide range of applications, including computing, communication, networking, consumer electronics, telecommunications, industrial control systems, automotive electronics, digital cameras, and other commercial products. The Electronic Manufacturing Services division encompasses both product manufacturing and related services. It produces a broad spectrum of items, such as computer motherboards and PC cards, solar controllers and inverters, photoelectric and industrial analytical measurement instruments, network communication security systems, automotive electronics, Internet of Things (IoT) devices, FPGA boards, USB drives, and solid-state drives. These specialized offerings cater to high-demand industries including oil and gas, aerospace and satellite, military and extreme environments, and medical sectors. Beyond manufacturing, the EMS segment delivers comprehensive services. These include printed circuit board (PCB) assembly, full box-build solutions, system integration, packaging, and thorough inspection and testing. Engineering support is extensive, covering new product introduction (NPI) management, design for manufacturability (DFM), design for testability (DFT), and managing engineering changes. Additionally, the company offers robust materials management solutions, encompassing material planning, supply chain oversight, and warehouse management systems. For clients seeking end-to-end support, Orient Semiconductor provides complete turnkey solutions, integrating services from wafer probing and substrate/lead frame design to manufacturing design, assembly, and testing.

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Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

ASEH3711 · SemiconductorsTaiwan

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ASE Technology Holding Co., Ltd., established in 1984 and headquartered in Kaohsiung, Taiwan, operates as a prominent global provider of semiconductor packaging, testing, and electronic manufacturing services. The company serves clients across the United States, Taiwan, the wider Asian region, Europe, and other international markets. Its extensive service portfolio includes a broad array of packaging solutions, from conventional options like various BGA, CSP, QFP, and QFN packages, to advanced techniques such as flip chip BGA, fan-out wafer-level packaging, and 2.5D silicon interposer technology. ASE also specializes in stacked die solutions, copper and silver wire bonding, the development of system-in-package (SiP) products and modules, and the provision of interconnect materials, including the assembly of automotive electronic components. Its comprehensive testing capabilities span front-end engineering, wafer probing, and final testing for diverse devices including logic, mixed-signal, RF modules, SiP, MEMS, and discrete components. Beyond its core semiconductor operations, the company is involved in a variety of other ventures, such as real estate development and management, substrate production, information software, equipment leasing, investment advisory, warehousing management, and the processing and trade of computer, communication peripherals, and electronic components.

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Sanken Electric Co., Ltd. engages in the creation, acquisition, and distribution of electrical machinery and related devices. Its operations are organized into two principal divisions: Semiconductor Devices and Power Systems. The Semiconductor Devices division focuses on developing and commercializing a broad array of components, including power modules, various integrated circuits (power, control, and Hall-effect types), bipolar transistors, MOSFETs, IGBTs, thyristors, rectifier diodes, and light-emitting diodes. In parallel, the Power Systems division is responsible for producing and supplying products such as uninterruptible power supplies (UPS), inverters, DC power sources, airway beacon systems, switching mode power supply units, and transformers. These offerings find extensive application across numerous sectors, such as the automotive industry, household appliances ("white goods"), industrial equipment, office automation systems, and consumer electronics like televisions and audio systems. Additionally, the company undertakes construction projects, particularly those related to electronic and telecommunication infrastructure. Sanken Electric maintains a significant international footprint, conducting business in key markets including Japan, China, Korea, the United States, Europe, and beyond. The company was established in 1946. Initially known as Toho Sanken Electric Co., Ltd., it formally adopted the name Sanken Electric Co., Ltd. in June 1962. Its corporate headquarters are situated in Niiza, Japan.

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ShunSin Technology Holdings Limited engages in the assembly, testing, and sale of various integrated circuits related to semiconductors in Mainland China, the United States, Taiwan, Malaysia, Singapore, Ireland, and internationally. The company’s products include system in package module, including 2G/2.5G/3G/4G front end and power Amplifier (PA), multi-mode multi band power amplifier, WiFi front end, mobile WiFi, and antenna switch modules; passive optical components; optical transceivers; thick film integrated circuit; and MEMS modules and sensors, such as accelerometers, gyroscopes, G-sensors, pressure and gesture sensors, light and proximity sensors, BAW filters, and TOF sensors. It offers engineering services, such as assembly and testing. The company was formerly known as Amtec Holdings Limited and changed its name to ShunSin Technology Holdings Limited in August 2013. The company was incorporated in 2008 and is based in Zhongshan, China. ShunSin Technology Holdings Limited is a subsidiary of Foxconn (Far East) Limited.

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China Resources Microelectronics Limited (CR Micro) functions as an investment holding company with diverse operations across the semiconductor industry. Its core business activities encompass open foundry services, integrated circuit (IC) design, IC testing and packaging, and the development of discrete semiconductor devices. In its foundry segment, CR Micro offers advanced IC manufacturing solutions to both fabless design firms and integrated device manufacturers. These services are underpinned by a range of analog and power process technologies, such as mixed-signal, complementary metal-oxide-semiconductor (CMOS) logic, planar and trench double diffused metal oxide semiconductor (DMOS), bipolar and CMOS technology (BiCMOS), and BCDMOS devices. Beyond manufacturing, the company excels in the design and development of various semiconductor integrated circuit products. This includes microcontrollers (MCUs) and System-on-Chips (SoCs) for audio and video processing, as well as analog and mixed-signal ICs tailored for power management and LED driver applications. Furthermore, CR Micro develops consumer ICs and wafers, encompassing components like single-chip radio circuits, audio and calculation amplifiers, encoder/decoder circuits, LCDs, voice and music chips, clock and watch circuits, uninterruptible power supplies (UPS), and photoelectric coupled receiver chips. CR Micro also offers comprehensive IC assembly, testing, and packaging services to other semiconductor companies. Lastly, the company is involved in the development and production of power semiconductor discrete devices, which find applications in energy-efficient lighting, household appliances, industrial control systems, and personal computing. CR Micro maintains a global footprint, with operations spanning Mainland China, other Asian markets, the United States, and Europe. Founded in 1997, the company initially operated as CSMC Technologies Corporation before adopting its current name, China Resources Microelectronics Limited, in 2008. Headquartered in Wuxi, China, it is classified as a Red Chip company, a designation stemming from its listing on the Hong Kong Stock Exchange. As of November 2, 2011, CR Micro has been a subsidiary of China Resources (Holdings) Co.,Ltd.

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SemiLEDs Corporation develops, manufactures, and sells light emitting diode (LED) chips, components, and modules and systems in the United States, Taiwan, the Netherlands, Japan, and internationally. The company also sells enhanced vertical, LED product series in blue, white, green, and UV; LED chips to packagers or distributors; and lighting products primarily to original design manufacturers of lighting products and the end-users of lighting devices, as well as packs and sells its LED products. Its products are used for general lighting applications, including commercial, industrial, and residential lighting; LED luminaries and LED retrofits; and specialty industrial applications, including ultraviolet curing of polymers, LED light therapy in medical/cosmetic applications, counterfeit detection, germicidal and viricidal devices, LED lighting for horticulture applications, architectural lighting, and entertainment lighting. SemiLEDs Corporation was incorporated in 2005 and is based in Chu-Nan, Taiwan.

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AOI Electronics Co., Ltd. functions as a Japanese manufacturer and distributor specializing in electronic components. The company's product line features a variety of items such as integrated circuits, diverse modules, thick film thermal print heads, optical sensors, LED products, chip resistor networks, and micro electromechanical system (MEMS) devices. Founded in 1969, AOI Electronics maintains its main offices in Takamatsu, Japan.

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ChipMOS TECHNOLOGIES Inc. specializes in the research, development, manufacturing, and global sale of sophisticated integrated circuits, complemented by extensive assembly and testing services. The company's operations are divided into several key segments: Testing, Assembly, Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors, Bumping, and Other services. Its comprehensive back-end offerings include engineering tests, wafer probing, and final testing for both memory and logic/mixed-signal semiconductors, alongside package assembly using leadframe-based and organic substrate-based technologies. Furthermore, ChipMOS provides specialized services such as gold bumping, reel-to-reel assembly, and testing specifically for LCD and other display panel driver semiconductors. These semiconductors are integral to a wide array of applications, including personal computers, graphics systems like game consoles, communications infrastructure, mobile products such as cellular handsets and tablets, various consumer electronics, automotive and industrial systems, and display technologies. Established in 1997, ChipMOS TECHNOLOGIES Inc. is headquartered in Hsinchu, Taiwan, and serves clients across Taiwan, the People's Republic of China, Japan, Singapore, and other international markets.

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VisEra Technologies Company Ltd., headquartered in Hsinchu City, Taiwan, is a global producer and supplier of electronic components. Established in 2003, the company operates as a key subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC). VisEra is deeply involved in the entire lifecycle of color filters, encompassing everything from initial design, research, and development, through manufacturing, packaging, and rigorous testing, all the way to market distribution. Beyond color filters, their product portfolio extends to a variety of sophisticated sensors, including image sensors, optical fingerprint sensors, ambient light sensors, and time-of-flight sensors. The company also offers specialized services such as wafer-level testing and the application of optical thin films at the wafer level. Furthermore, VisEra provides comprehensive optical component services, covering manufacturing, simulation, integration, wafer-level characterization, and tailored solutions to meet specific client needs. These advanced products and services are integral to a wide range of modern applications, including the automotive industry, security systems, augmented and virtual reality devices, smart home technology, mobile communication devices, and biomedical sensing equipment. VisEra distributes its offerings across Taiwan, various other parts of Asia, Europe, and the United States.

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Elmos Semiconductor SE, operating globally with its subsidiaries, specializes in the design, manufacture, and sale of advanced semiconductors and sensors, predominantly serving the automotive sector. Its product portfolio encompasses a variety of sensor integrated circuits (ICs), such as ultrasonic distance sensors, signal processors for sensors, integrated absolute pressure systems, optical infrared sensors, Time-of-Flight (ToF) imagers, and passive infrared ICs. The company also provides interface ICs like PSI5, LIN/CAN, and KNX/EIB transceivers. Furthermore, Elmos delivers specialized project solutions, including ASIC design services, alongside dedicated automotive safety, engine management, and relay driver ICs. Its offerings extend to motor control ICs, covering stepper, brushless DC, and standard DC motor controllers, as well as power management ICs, exemplified by LED drivers, DC/DC converters, and low dropout regulators. These components find wide application in automotive systems like ADAS (Advanced Driver-Assistance Systems) and safety features, body electronics and convenience functions, infotainment, lighting, and powertrain management. Beyond the automotive realm, they are also integral to smart home and industrial automation technologies. Established in 1984, the company maintains its headquarters in Dortmund, Germany.