ASMPT

ASEH3711 · SemiconductorsTaiwan

68% matchPublic

ASE Technology Holding Co., Ltd., established in 1984 and headquartered in Kaohsiung, Taiwan, operates as a prominent global provider of semiconductor packaging, testing, and electronic manufacturing services. The company serves clients across the United States, Taiwan, the wider Asian region, Europe, and other international markets. Its extensive service portfolio includes a broad array of packaging solutions, from conventional options like various BGA, CSP, QFP, and QFN packages, to advanced techniques such as flip chip BGA, fan-out wafer-level packaging, and 2.5D silicon interposer technology. ASE also specializes in stacked die solutions, copper and silver wire bonding, the development of system-in-package (SiP) products and modules, and the provision of interconnect materials, including the assembly of automotive electronic components. Its comprehensive testing capabilities span front-end engineering, wafer probing, and final testing for diverse devices including logic, mixed-signal, RF modules, SiP, MEMS, and discrete components. Beyond its core semiconductor operations, the company is involved in a variety of other ventures, such as real estate development and management, substrate production, information software, equipment leasing, investment advisory, warehousing management, and the processing and trade of computer, communication peripherals, and electronic components.

Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products in Taiwan, Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. It provides chip probing and final test; IC packaging services, such as wafer level packing, flip chips, wire bond BGA, lead frame, and system in package; module assembly services; and quality management services. The company is also involved in the design, manufacturing, assembly, testing, and sale of semiconductors; metal surface treatment on semiconductor wire frame; and metal plating on semiconductor lead frame, as well as in investment and wafer probing testing activities. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

ams-OSRAM0QWC · SemiconductorsPremstätten, Austria

65% matchPublic

ams-OSRAM AG is a global enterprise specializing in the development, production, and distribution of advanced LED and optical sensing technologies. Its operations span Europe, the Middle East, Africa, the Americas, and the Asia-Pacific region. The company organizes its activities into two principal divisions: Semiconductor and Lamps & Systems. The Semiconductor division provides a diverse range of semiconductor-based products, including light-emitting diodes (LEDs), lasers, and various optical and image sensors. These components are vital for applications in the automotive, consumer electronics, and industrial sectors. Conversely, the Lamps & Systems division delivers comprehensive lighting products and solutions. This encompasses sophisticated offerings such as spectral sensing, intelligent and ambient lighting, horticultural illumination, time-of-flight sensors, presence detection, near-infrared technology, human-centric lighting, and both outdoor and indoor lighting systems. Its primary clientele are found in the automotive, industrial, and medical fields. Established in 1981, the company was previously known as ams AG before adopting its current name, ams-OSRAM AG, in January 2022. Its corporate headquarters are located in Premstätten, Austria.

ShunSin Technology Holdings Limited engages in the assembly, testing, and sale of various integrated circuits related to semiconductors in Mainland China, the United States, Taiwan, Malaysia, Singapore, Ireland, and internationally. The company’s products include system in package module, including 2G/2.5G/3G/4G front end and power Amplifier (PA), multi-mode multi band power amplifier, WiFi front end, mobile WiFi, and antenna switch modules; passive optical components; optical transceivers; thick film integrated circuit; and MEMS modules and sensors, such as accelerometers, gyroscopes, G-sensors, pressure and gesture sensors, light and proximity sensors, BAW filters, and TOF sensors. It offers engineering services, such as assembly and testing. The company was formerly known as Amtec Holdings Limited and changed its name to ShunSin Technology Holdings Limited in August 2013. The company was incorporated in 2008 and is based in Zhongshan, China. ShunSin Technology Holdings Limited is a subsidiary of Foxconn (Far East) Limited.

Orbotech (a KLA Company)SemiconductorsIsrael

63% match

KLA provides process control and yield management solutions using advanced inspection tools, metrology systems, and computational analytics. The company serves the electronics and chip manufacturing industry by offering technologies designed to boost innovation speed and performance.